As a technology and market leader worldwide, HBM offers products for test and measurement including load cells, transducers, and strain gauges.

High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

High precision, even with low nominal (rated) forces, offers an extremely wide measuring range and reliable results with the best price-to-performance ratio. Precise, s-shaped S2M force transducer for small forces up to 1 kN. Cost-effective, configurable, and with an overload stop.

Buying online is a safe and convenient way to quickly purchase HBM products, while saving money! Within the HBMshop, you can easily locate compatible accessories and spare parts through easy navigation, or search our catalog of more than 4.000 products, by …

Z6 Bending Beam Load Cell: The Market Standard for Precision and Robustness in the Weighing Range from 5 kg to 1 t. The precise Z6 bending beam load cell, developed by HBM in 1972, has been continuously optimized for decades. Z6 is based on the strain gauge technology.

With FIT7A, for the first time you can build your own checkweigher for your packaging line. There is no need for you to purchase expensive components and you become more competitive and independent. Why opt for the checkweigher load cell from HBK? We are a pure supplier of weighing technology components.

HBM: The World's Leading Load Cell Manufacturer. In the production and manufacturing of load cells, you can trust that we deliver quality in our wide-ranging list of products we offer. HBM provides you with an infrastructure and partnership you can trust - …

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.

HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor

Silicon Interposer (2.5D) is the incumbent technology of choice. Potentially lower cost, fine pitch interconnect wafer-level and substrate based technologies are emerging .