M5 Pro chip could separate CPU and GPU

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a ...
In a blog post on Medium, Apple insider Ming-Chi Kuo revealed interesting details about Apple's future iPhone 18 and M5 Mac ...
Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming ...