Neural net devs are finally getting serious about efficiency Feature  If you've been following AI development over the past ...

Samsung will replace silicon with glass interposers in AI chip packaging by 2028, aiming to boost performance and reduce costs.

I believe surging HBM demand and data?center spending will power solid growth while tariff fears prove overblown ...

SEMI reports potential for atypical shifts due to tariff uncertainty According to the Q1 2025 Semiconductor Manufacturing ...

Explore the challenges of HPC and the memory wall. Learn how processor speed and memory bandwidth affect performance.

Gearing up for another school year? If you're a parent like me, you know it is never too early to search for a reliable ...

Infinix GT 30 Pro will be available in Blade White and Dark Flare colour options and is expected to carry forward several ...

Fundamentally, the DDR5 — which is the latest generation of DRAM technology — is currently in an upgrade cycle. As such, ...

SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a technology expected to be introduced for the artificial ...

SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence memory chips with plans to introduce vertically stacked 3D HBM from its ...

LEO doesn't review graphics cards for KitGuru.net (Allan 'Zardon' Campbell is the KitGuru GPU reviewer) but he wanted to give his own thoughts on AMD - their upcoming Fiji- Fury X, HBM and possible ...

NVIDIA's new special edition Blackwell AI GPU for China expected to be named 6000D or B40, GDDR7 and not HBM, will support ...