For HBM market leader SK Hynix, the deal with Nvidia is important to maintain its dominant market position, as HBM3e will also come from Micron and Samsung, so another technological leap would be ...

SK Hynix Inc., the world’s second-largest memory chipmaker, reported a dramatic surge in first-quarter profits on Thursday, delivering the second-highest quarterly earnings in its history, driven by ...

This paper introduces FlexENM, a low-power and areaefficient near-eDRAM encryption engine. The FlexENM implements refresh-less operation by leveraging inherent characteristics of the AES algorithm, ...

SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence memory chips with plans to introduce vertically stacked 3D HBM from its ...

signaling a strategic push to expand its high-bandwidth memory (HBM)... Save my User ID and Password Some subscribers prefer to save their log-in information so they do not have to enter their ...

Abstract: This article presents cache-processing-in-memory (PIM), an error correction code (ECC)-compatible embedded dynamic random access memory (eDRAM) PIM-based ...

General Purpose eDRAM process by the foundry's IP Alliance program. TSMC's IP Alliance includes a quality management program that requires IP cores to demonstrate manufacturability and functionality.

Surging DRAM prices and booming HBM demand, fueled by Middle East AI investments and global tariff fears, are expected to boost earnings for Samsung Electronics and SK Hynix. Major clients are rushing ...

DigiTimes reports that the former employee subcontractor aimed to leak the firm’s proprietary high-bandwidth memory (HBM) packaging technology to entities based in China. According to the source ...

He has advanced semiconductor memory technology, focusing on RRAM, eDRAM, ferroelectric materials, and novel transistor architectures for eDRAM scaling. Now in Intel Foundry’s Process Technology ...

An enhancement to NEC Electronics’ patented metal-insulator-metal (MIM2) technology, the new eDRAM process is the industry’s first combination of hafnium silicate film and nickel silicide, which ...