With this investment, Accretech further strengthens its position as a full-service solution provider in the semiconductor ...

Let's analyze the possibilities. A 300-mm wafer can fit roughly 72 GB202 candidates, assuming that one die measures roughly 31.5 mm × 24.2 mm. This is not a lot, considering the fact that TSMC ...

Speedy progression and augmentation of the Internet of Things is a prominent factor driving the wafer processing equipment market. The wafer processing equipment market is augmenting. The market is ...

China's wafer foundry industry will generate US$13.22 billion in revenue in 2024, representing a 16% year-on-year growth, slightly exceeding the global growth rate of 14%. The revenue momentum of ...

Despite this resilience, the earthquake may have affected between 10,000 to 20,000 wafers currently in production. These wafers are critical for TSMC's operations, particularly within its advanced ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...

Demand for precise semiconductor manufacturing drives growth in the Wafer Dicing Saws Market, enabling innovation in microelectronics. Wafer dicing saws are at the heart of microchip production, ...

KUALA LUMPUR: Dagang Nexchange Bhd (DNeX) plans to build a new 12-inch wafer fabrication facility in Malaysia in a joint effort with Hon Hai Precision Industry Co Ltd (or Foxconn) remain in progress.