RPS roams the hills of a generated Czech wilderness while talking to PlayerUnknown Productions' Brendan Greene about his ...

Researchers from the University at Buffalo, Central South University, Shandong Normal University, Sungkyunkwan University, TU ...

Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the ...

We expect Lam to focus on generating strong cash flow while prioritizing its R&D investments. We also expect it to remain moderately leveraged. As of June, Lam held a net cash position, with $5.8 ...

The AI chip market is booming, driven by autonomous vehicles, generative AI, and edge computing, with Nvidia, Intel, and AMD leading innovation in sp ...

The top of the back will comprise a larger rectangular camera bump made of aluminium rather than traditional 3D ... non-Pro models. TSMC's upcoming N3P technology is thought to feature. This is said ...

Markforged founder Greg Mark has moved from hardware to software, with a text-to-3D model platform called Backflip.

This is an amazingly realistic 3D model of San Francisco’s Sutro Tower that you can zoom, pan, fly through, and interact w ...

Infineon is advancing industry-wide standardization by offering its CoolGaN G3 transistors in silicon MOSFET packages.

Until 2018, DRAM peripheral transistors were predominantly made in planar logic MOSFET technology with poly-Si/SiO 2 or ...

Rapid, localized heat management is essential for electronic devices and could have applications ranging from wearable materials to burn treatment. While so-called thermoelectric materials convert ...