TSMC reported record profits for the fourth quarter of 2024, fueled by booming demand for artificial intelligence (AI) chips.

TSMC's strong FY24 performance driven by AI chip demand and 3nm chip production, with continued growth projected despite ...

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Industry analysts cited in the report noted that TSMC’s vision for silicon photonics revolves around integrating CPO modules ...

TAIPEI : TSMC, the world's largest contract chipmaker, on Friday reported fourth-quarter revenue of T$868.42 billion ($26.36 billion), according to Reuters calculations, easily beating a market ...

KLA's portfolio means it is primed to capitalize on market trends in 2025 like AI and advanced packaging. Learn why KLAC ...

To support the IP integration in the bottom dies using TSMC’s SoIC ®-X technology, it can be placed “face up” with adding TSVs for supplies and interface signals. “We are committed to delivering the ...

Some of the largest construction projects in the country, including the largest foreign direct investment in a greenfield site, are underway in Arizona. While Taiwan Semiconductor Manufacturing Co ...

A new optical computing era TSMC’s approach involves integrating CPO modules with advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS) or small outline integrated circuit (SOIC).

SoIC is TSMC's take on 3D stacking and hybrid wafer bonding, which enables ultra-dense connections between two chips. The "mH" variant Apple is using allows them to glue the separate dies ...

This change aligns with Apple’s ambition to push the boundaries of silicon design. Advanced Packaging with TSMC’s SoIC-mH To support this architectural shift, Apple is reportedly leveraging TSMC’s ...