Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an event hosted by ...

CoWoS stands for chip wafer on a substrate. The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD (AMD). However ...

TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

The revised road plan presents ... sees the drop in CoWoS-S capacity as a purposeful change rather than a reaction to diminishing demand, the study said. The earnings call by TSMC on January ...