Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

TSMC is advancing its compact optical engine technology, branded as COUPE, a top priority among its emerging innovations.

I note that TSMC's expansions in advanced packaging (CoWoS) facilities in Taiwan are also margin-dilutive: advanced packaging accounted for over 8% of revenue last year. And it will account for ...

TSMC's FY24 performance exceeded expectations ... 58%, as the conglomerate prepares to ramp up its N2 fabs and CoWoS expansion. At the same time, there will be cost headwinds from overseas ...

What just happened? As the world's leading semiconductor manufacturer, TSMC's production halt following the 6.4-magnitude earthquake in Taiwan has triggered industry-wide concern. Its customers ...

Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered ...

Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered ...

Strong demand for artificial intelligence chips has delivered a stellar quarter for Taiwan Semiconductor Manufacturing Co., or TSMC. The company said Thursday that revenue for the December quarter ...

TSMC said it evacuated personnel from some buildings and the science park in Tainan, Taiwan. TSMC said that buildings there started evacuations when the quake first hit. TSMC’s Fab 18 ...