TSMC encountered significant challenges when it began constructing its fab in Arizona, facing a trifecta of issues that underscored the stark contrast between fab construction in ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

Discover the possibilities of twisted bilayer graphene as a replacement for silicon in integrated circuits and it's potential.

Researchers from the University at Buffalo, Central South University, Shandong Normal University, Sungkyunkwan University, TU ...

Research team led by Dr. Seo at KERI develops radiation resistance evaluation technology for SiC power semiconductors.

The US, China and Japan are working on research and development in gallium oxide crystal growth and productionizing gallium ...