Infineon’s SiC power modules, built on CoolSiC™ MOSFET technology ... The high heat tolerance and low inductance packaging further enhance the performance of the SiC devices, contributing to overall ...

In a recent webinar, Infineon showcased the OptiMOS power MOSFET series in source-down (S ... semiconductor technologies (including SiC and GaN), innovative packaging (multi-die embedding, modules, ...

GaN suppliers have taken various approaches to packaging, leading to a lack of multiple footprint-compatible sources for ...

And even if you have that solution, it doesn’t apply when you have power in the backside ... On the design side there is DesignCon and Hot Chips, and in the packaging world there are ECTC and IMAPS.

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference ...

The transistors offering ultra-low resistance, superior thermal performance, and industry-standard packaging for seamless GaN integration in power applications. Infineon Technologies AG is setting a ...

SemiQ’s 1,200-V full-bridge SiC modules target photovoltaic inverter, energy storage and battery charging applications.

Throughout your career, what do you see as the most transformative change in packaging and test? The core functions of the semiconductor package have remained consistent over the years, which provide ...

The European Commission has approved funding under the European Chips Act for Infineon's Smart Power Fab in Dresden, bringing ...

uninterruptible power supplies, generators, and automotive tech. Most recently, he was Section Editor, Mobile at Digital Trends, spearheading his team's coverage of breaking news, features ...

The Price to Earnings (P/E) ratio, a key valuation measure, is calculated by dividing the stock's most recent closing price by the sum of the diluted earnings per share from continuing operations ...