After successfully launching the 7th generation Micro-Pattern Trench (MPT) technology-based discrete IGBT new products in Q2 ...

a “ plug-and-play” power module that implements a combination of Infineon’s silicon and SiC technologies. The pre-configured, third-generation EiceDRIVER products—1EDI302xAS (IGBT ...

IGBT, and diode technologies, ACEPACK modules provide multiple pinout configurations for enhanced design flexibility. Additionally, the option of Press-FIT or soldered pin connections simplifies the ...

These devices are specifically designed to support the latest IGBT and SiC technologies, enhancing their application in advanced power systems. They also complement Infineon’s HybridPACK™ Drive G2 ...

Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...

Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first ...

In addition to the power supply, additional monitoring and control functions are integrated, enabling customers to develop automotive ECUs for safety-related applications. Infineon has now added the ...

Neubiberg, Germany – December 28, 2009 – Infineon Technologies AG (FSE ... consisted of fourteen patents related to super-junction power transistors along with trench power MOSFETs and IGBT power ...

Good morning, everyone. Welcome to the Conference Call for Analysts and Investor for 2025 First Fiscal Quarter Results of Infineon. Today's call will be hosted by Alexander Foltin, Executive Vice ...