The latest EiceDRIVER isolated gate drivers from Infineon Technologies are optimized for SiC technologies targeting electric ...
IGBT, and diode technologies, ACEPACK modules provide multiple pinout configurations for enhanced design flexibility. Additionally, the option of Press-FIT or soldered pin connections simplifies the ...
Neubiberg, Germany – December 28, 2009 – Infineon Technologies AG (FSE ... consisted of fourteen patents related to super-junction power transistors along with trench power MOSFETs and IGBT power ...
GaN suppliers have taken various approaches to packaging, leading to a lack of multiple footprint-compatible sources for ...
The European Commission has approved funding under the European Chips Act for Infineon's Smart Power Fab in Dresden, bringing ...
The Price to Earnings (P/E) ratio, a key valuation measure, is calculated by dividing the stock's most recent closing price by the sum of the diluted earnings per share from continuing operations ...
SemiQ Inc, a developer of SiC devices, has announced a family of three 1200V SiC full-bridge modules, each integrating two of ...
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