HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Conceptually, HBF is similar to HBM. It stacks multiple high-capacity, high-performance flash core dies interconnected using through-silicon vias (TSVs) on top of a logic die that can access flash ...

SanDisk unveils High Bandwidth Flash (HBF), a NAND-based alternative to HBM HBF matches HBM bandwidth ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC ...

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

whereas in HBM you are looking at a 128-bit channel for each stack. You have to simulate all the signal traces along with all of the power delivery network, and this traverses from one die through ...

Celestial AI Inc., a startup that develops optical technology for linking chips, has raised $250 million in funding at a $2.5 ...

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

The HBM Gen2 PHY – delivered as a fully characterized hard macro – includes all necessary components for robust operation, such as IO pads, PLL, clock distribution, transmit and receive paths, control ...

Just like the predecessor, HBM3/2E supports two, four, eight or twelve DRAM devices on a base logic die (2Hi, 4Hi, 8Hi, 12Hi stacks) per KGSD. HBM Gen 3 expands the capacity of DRAM devices within a ...