A new technical paper titled “HBM Roadmap Ver 1.7 Workshop” was published by researchers at KAIST’s TERALAB. The 371-page ...

The choice of DRAM depends on where the action is.

A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM ...

HBM roadmap teases HBM4, HBM5, HBM6, HBM7, HBM8 with HBM7 dropping by 2035 with new AI GPUs using 6.1TB of HBM7 and 15,000W ...

SoftBank and Intel plan low-power memory to rival South Korean HBM Saimemory aims for 2030 launch but faces major market ...

Samsung Electronics has secured a key supply deal with AMD, with its fifth-generation 12-layer HBM3E memory selected for the chipmaker’s upcoming MI350 AI accelerators. The move marks a breakthrough ...

Alliance Memory products, Soitec collaborating with Powerchip, the UKESF launching the Semiconductor STEP programme, Broadcom ...

Abstract: Recent major progress in the area of advanced DRAM cell structures is described, focusing on three-dimensional approaches. Cell design criteria are first outlined. Then a number of ...

HBM will top GPU in determining AI performance, says leading Korean semiconductor researcher ...

While Micron’s DRAM and HBM segments are thriving ... The move of the company to QLC (quad-level cell) NAND for high-density storage solutions is good for the long term but has been slower ...

Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The new chip ...