The new Google Pixel 9a has a flat back design which means no more camera bump. Credit: Joe Maldonado / Mashable Google released the Pixel 9 to mostly rave reviews last summer. However ...

For common eutectic solder that contains lead, that's 360 °F (182 °C). When the iron is warm enough, the solder (usually available in the form of a spooled wire) is fed to the contact points of ...

That lump can sometimes be a problem if you need to tuck the wiring back into a tight space. A solder seal butt connector for 10-12 gauge wire. Solder seal butt connectors are made of a clear ...

“Having a very low melting point during bonding, but not during the operation of the device, is one of the key attributes of eutectic bonding,” Schmidt said. Because solder bumps are metal, they also ...

As always, size and cost are the determining factors. Copper microbumps are smaller than solder balls/bumps, enabling more I/Os in packages. In today’s advanced packages, the most advanced microbumps ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...