In the main portion of the reliability testing, two temperature ranges (-40 to 125/spl deg/C and -40 to 150/spl deg/C) and five different solder alloys have been examined. The investigated solders ...

Gold tin solder in the packaging of high-power LED chip is mainly used in chip bonding technology and chip-level packaging technology, its role is to connect the chip with the substrate or lead to ...

Creative Commons (CC): This is a Creative Commons license. Attribution (BY): Credit must be given to the creator. Article Views are the COUNTER-compliant sum of full text article downloads since ...

Key Laboratory of Colloid and Interface Chemistry, Ministry of Education, Shandong University, No. 27, Shanda Nanlu, Jinan 250100, PR China ...