Design engineers need ESD and TLP characterization data to make informed decisions to design robust circuits and systems.

Our Services Include: Diagnosis of ESD and Latch-Up Failures – Specialized support for HBM, CDM, and IEC test diagnostics. Product Failure Analysis – In-depth analysis to identify and address ...

The Compute Express Link (CXL) interface protocol enables low-latency data communication between system-on-chip (SoC) and general-purpose accelerators, memory expanders, and smart I/O devices ... The ...

Electrostatic discharge (ESD) disrupts the normal operation ... and packages by simulating HBM and CDM events. They integrate transient effects and package considerations to accurately model device ...

For a while now, many AI researchers have been working to integrate a so-called "world model" into their systems. Ideally, these models could infer a simulated understanding of how in-game objects ...

Also included is a range of IEC 61000-4-2 system-level ESD protection that supports digital and analog I/O cells. View 1.8V/3.3V flipchip I/O library with 4kV HBM ESD protection, I2C compliant ODIO ...

SK Hynix said it began supply of 12-layer HBM3E chips, the most advanced HBM model currently in mass production, to a customer in the fourth quarter. It expects it will start supplying even more ...

The model explains 59% of variance changes in rural youth preventive behaviors during COVID-19. Cue to action is the strongest and self-efficacy was the weakest determinant of youth's preventive ...

Studying different animals during embryonic development has provided insights into how somites form and grow, but it is technically difficult to do and only provides an approximate model of how ...