NXP and Rimac jointly develop a centralized architecture for SDVs, consolidating more than 20 ECUs into three units.

Diodes Inc. releases its first ReDriver to support PCIe 6.0 protocol speeds, while backward compatible with PCIe 5.0/4.0/3.0 ...

MEMS sensors open up new product design opportunities with high accuracy, improved safety, and enhanced functionality.

Renesas’ RA2L2 ultra-low-power MCUs, with USB-C Rev. 2.4 support, target portable devices and PC peripherals. Renesas ...

Same Sky’s AMT25 absolute encoder series supports 9-mm to 15.875-mm motor shafts for a range of industrial applications.

STMicroelectronics introduces Stellar automotive MCUs with next-gen extensible memory, delivering scalability in SDV and EV ...

Samtec offers high stability Nitrowave microwave cable assemblies for lab test and rugged environments such as ...

Battery energy storage systems will play a key role in energy management as demand for sustainable and reliable energy ...

Broadcom’s 102.4-Tbits/s Ethernet switch chip, with options for 100G and 200G SerDes, targets scale-up and scale-out AI ...

Innovations in AI, AIoT, edge computing, and sensor fusion are driving the next generation of advances in smart cities and ...

Infineon and Typhoon HIL are collaborating on a hardware simulation and test solution to accelerate the development of xEV power systems.

Hirose introduces the FH79 Series back-flip FPC connector with a 40% reduction in width, targeting automotive and other harsh ...