According to this leaker, the CPU and GPU of these chips will reportedly be designed separately, and later molded together, using the SoIC-mH packaging technology from TSMC. SoIC-mH stands for ...

The technology integrates microring modulators with advanced packaging like CoWoS or SoIC. Mass production is expected in late 2025, with shipments in 2026. TSMC's next-gen silicon photonics ...

To support the IP integration in the bottom dies using TSMC’s SoIC ®-X technology, it can be placed “face up” with adding TSVs for supplies and interface signals. “We are committed to delivering the ...

A new optical computing era TSMC’s approach involves integrating CPO modules with advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS) or small outline integrated circuit (SOIC).

SoIC is TSMC's take on 3D stacking and hybrid wafer bonding, which enables ultra-dense connections between two chips. The "mH" variant Apple is using allows them to glue the separate dies ...

KLA's portfolio means it is primed to capitalize on market trends in 2025 like AI and advanced packaging. Learn why KLAC ...

With Apple’s M5 chip expected to launch this year, what kind of performance and features should you expect? We’ve scoured the ...

Industry analysts cited in the report noted that TSMC’s vision for silicon photonics revolves around integrating CPO modules ...

According to Kuo’s post, he claims that the M5 will adopt TSMC’s advanced N3P node. This also means that for the M5 Pro, M5 Max, and M5 Ultra chipsets, Apple will utilize server-grade SoIC ...

In addition to the camera upgrades, Kuo predicts the iPhone 18 Pro will run on Apple’s M5 chip series, leveraging TSMC’s advanced ... featuring SoIC packaging for enhanced performance and ...

Instead, the M5 Pro and other chips will use manufacturer TSMC's latest chip packaging process. Called the System-in-Integrated-Chips-Molding-Horizontal (SoIC-mH), it puts together different chips ...