TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...

According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor industry.

The technology integrates microring modulators with advanced packaging like CoWoS or SoIC. Mass production is expected in late 2025, with shipments in 2026. TSMC's next-gen silicon photonics ...

TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow recovery in ...

It’s believed TSMC could further expand its manufacturing operations in Japan down the road. Earlier this year ... TSMC might use the facility to make CoWoS hardware. This is a type of packaging ...

The company's advanced packaging technologies, such as CoWoS, and its leadership in 3nm and 2nm nodes, ensure its competitive edge in HPC and AI markets. Financially robust, TSMC reported $23.5 ...

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

According to Taiwan-based daily DigiTimes, Nvidia reportedly secured 60% of TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology for 2025. DigiTimes also says that TSMC is planning to ...

TSMC is also expected to double its capacity of advanced packaging technology, or chip-on-wafer-on-silicon (CoWoS), mostly used in AI chips for Nvidia Corp, to 660,000 units next year, from 330,000 ...

The company has been smart too, doubling down on advanced packaging tech like CoWoS (Chip on Wafer on Substrate), which is essential for manufacturing AI processors. It's no wonder TSMC expects ...