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Digi Times
1d
TSMC prioritizes COUPE tech, eyes silicon photonics lead
TSMC is advancing its compact optical engine technology, branded as COUPE, a top priority among its emerging innovations.
EDN
4d
Nvidia, TSMC, and advanced packaging realignment in 2025
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
Digi Times
5d
Weekly news roundup: Europe's chip ambitions falter; TSMC maintains CoWoS equipment orders
These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.
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