Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

The Commodore Amiga 1000 not only marked the beginning of the multimedia age in 1985. The architecture and its effects are ...

With UK summers only getting hotter, I tested whether a fixed air con installation was really worth it If there’s one thing I ...

At a time when many Pacific leaders are expressing concerns about the impacts of geopolitical competition in their respective ...

Hydrogen auctions are a policy tool used by governments to accelerate the development of clean hydrogen markets. They are a form of competitive public procurement, in which governments award financial ...

When you use DPReview links to buy products, the site may earn a commission. What you need to know Product photos: Sony As you may have seen, Sony has just refreshed its full-frame compact, the RX1R, ...

Efficient Computer’s Electron E1 general-purpose processor claims up to 100× higher energy efficiency than general-purpose ...

OnePlus Buds 4 deliver an extremely good noise cancelation experience, and pair it with a rich sound output and solid battery ...

A clever method from Caltech researchers now makes it possible to unravel complex electron-lattice interactions, potentially ...

Surface‑Optional Drafting. A declaration may expressly exclude the ground plane, enabling elevated or subterranean units without fee ownership of the dirt. Stackable & Non‑contiguous Parcels. Separate ...

Alpha and Omega Semiconductor's latest 25-V power MOSFET, which features source-down packaging, helps feed power-hungry GPUs ...

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