Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Praveen Vaidyanathan, vice president and general manager of Data Center Business at Micron. Timothy Prickett Morgan: Let's ...

Sandisk's split from Western Digital has led to divergent stock trajectories, with SNDK soaring and WDC tanking, validating ...

Samsung Electronics has promised angry shareholders it will pursue “meaningful achievements” in deals this year to revive growth after the South Korean tech giant suffered market share declines across ...

Lam Research benefits from the rise in AI-driven chip demand. Read why LRCX stock is a solid buy for long-term investors ...

Sandisk’s key objectives with HBF seems to be to match HBM bandwidth while providing ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC die.

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

To integrate HBM, complex via geometries need to be created for fanout/breakout structures for routing bits on the logic die to the HBM stack. * Once verified, the initial channel can be used as a ...

Celestial AI Inc., a startup that develops optical technology for linking chips, has raised $250 million in funding at a $2.5 ...

TSMC connects the HBM received from memory companies to NVIDIA graphics processing units (GPUs) to create AI accelerators. Starting with HBM4, a foundry process will be applied to the logic die, which ...