Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Conceptually, HBF is similar to HBM. It stacks multiple high-capacity, high-performance flash core dies interconnected using through-silicon vias (TSVs) on top of a logic die that can access flash ...

SanDisk unveils High Bandwidth Flash (HBF), a NAND-based alternative to HBM HBF matches HBM bandwidth ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC ...

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

HBMs are made up of 3D stacks of high-density DRAM memory modules with an optional base logic die. The memory modules in HBM are connected to the PHY in base logic die which communicates with the PHY ...

Celestial AI Inc., a startup that develops optical technology for linking chips, has raised $250 million in funding at a $2.5 ...

The HBM Gen2 PHY – delivered as a fully characterized hard macro – includes all necessary components for robust operation, such as IO pads, PLL, clock distribution, transmit and receive paths, control ...

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

Just like the predecessor, HBM3/2E supports two, four, eight or twelve DRAM devices on a base logic die (2Hi, 4Hi, 8Hi, 12Hi stacks) per KGSD. HBM Gen 3 expands the capacity of DRAM devices within a ...