Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Lam Research benefits from the rise in AI-driven chip demand. Read why LRCX stock is a solid buy for long-term investors ...

SK hynix Inc. (or "the company",  announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the ...

AstraZeneca has tapped Korea's Alteogen to develop subcutaneous cancer drugs. Taiho Pharmaceutical is paying $400 million to ...

This method involves bonding separate wafers for the NAND cell array and CMOS logic transistors ... However, Citi remains positive about Micron’s prospects in AI HBM and expects a recovery in the DRAM ...

This method involves bonding separate wafers for the NAND cell array and CMOS logic ... about Micron’s prospects in AI HBM and expects a recovery in the DRAM market. Lastly, SK Hynix plans ...

HBM accounts for nearly 30% of the DRAM storage industry ... As a result, 3D DRAM is a new type of DRAM technology with a novel memory cell structure that greatly increases the storage capacity per ...

including dynamic random-access memory (DRAM), flash memory (NAND), solid-state drives (SSDs), and High Bandwidth Memory (HBM ...