According to Counterpoint Research, robust HBM DRAM memory demand and a surge in advanced logic/foundry momentum in the ...

HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.

An interesting thought experiment to do in 2025 when looking at the financial results of just about any of the key compute, ...

Explore Micron's growth in HBM memory driven by AI demand, DRAM price cycles, and market dynamics in this deeply cyclical ...

Micron Technology sees 38.3% YoY revenue growth, driven by DRAM & NAND sales. Click for more about their challenges, Q3 ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height, a DFI-style interface to the memory controller, 2.5D interposer connections between the PHY and DRAM, a validated ...

SK hynix Inc. said Wednesday it has unveiled a sample of its next-generation high bandwidth memory (HBM) for the first time ...

The company also plans to open an HBM production facility in Hiroshima, Japan, by 2027. Micron’s HBM production capacity is expected to triple from 20,000 wafers per month at the end of 2024 to ...