HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.
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NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks3D X-AI can perform AI processing in each HBM chip. This can drastically reduce the data transferred between HBM and GPU to improve performance and reduce power consumption dramatically." ...
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