Mitsubishi backs next-gen tech to reduce e-waste, recover materials, and drive innovation in electronics sustainability.

In this article, we consequently focus on the oxidation and reduction kinetics of three commonly used eutectic solder alloys: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show ...

Abstract: Fluxless bonding processes using two different noneutectic gold-tin (Au-Sn) multilayer composites to fabricate high quality solder joints have been successfully achieved. In contrast to the ...

Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach preforms for critical laser and ...

Gold tin solder in the packaging of high-power LED chip is mainly used in chip bonding technology and chip-level packaging technology, its role is to connect the chip with the substrate or lead to ...

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For some people (e.g. this author) solder wick is a tool of last resort. Unfortunately, solder suckers and vacuum pumps lose most of their utility when you move from through-hole to SMD ...

Altus Group, a distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its ...

CICECO − Aveiro Institute of Materials, Department of Chemistry, University of Aveiro, 3810-193 Aveiro, Portugal Associate Laboratory LSRE-LCM, Department of Chemical and Biological Technology, ...