The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The ...

Abstract: Solder Ball Connect (SBC) is a second-level surface mount electronics packaging technology in which ceramic modules containing one or more chips are joined to a circuit card (FR-4) by means ...

The most common failure mode for his chips is “cratering” which is a type of damage to the solder that holds them to their PCBs. With so many pins in such a small area, and with small pins ...

Al-graphite composites; Sn-Ag-Ti alloy; Ultrasonic active soldering; Spreading area test; Ti 2 SnC Direct active soldering is an emerging technique for joining a range of materials by utilizing active ...

In 2003, deep eutectic solvents (DESs) were discovered. These are homogenous and transparent mixtures created by combining over two components in a specific molar ratio under certain conditions. They ...

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Department of Materials Science and Engineering, KTH Royal Institute of Technology, SE-100 44 Stockholm, Sweden ...

STM32 Based soldering station for JBC cartridges, 9-24 VDC and USB-PD power ...