Mitsubishi backs next-gen tech to reduce e-waste, recover materials, and drive innovation in electronics sustainability.

In this article, we consequently focus on the oxidation and reduction kinetics of three commonly used eutectic solder alloys: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show ...

Abstract: Fluxless bonding processes using two different noneutectic gold-tin (Au-Sn) multilayer composites to fabricate high quality solder joints have been successfully achieved. In contrast to the ...

Collaborative Innovation Center of Henan Province for Green Manufacturing of Fine Chemicals, Key Laboratory of Green Chemical Media and Reactions, Ministry of Education, School of Chemistry and ...