A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer diameter up ...

The results show that the resistance of encapsulated HTS-CCs goes through the flux flow state before reaching the normal. Then, the encapsulation can expand the limit of fault current, and a suitable ...