Abstract: Lead-free solder reflow process has presented challenges to no-flow underfill material and assembly. The currently available no-flow underfill materials are mainly designed for eutectic ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

Abstract: In order to reduce stress in the plastic small outline J-lead (SOJ) package and prevent the interface delamination under the infrared (IR) soldering process, parameterization, parametric ...

May 29, 2025—Reflow Medical, Inc. announced that the FDA has granted de novo clearance for the company’s Spur peripheral retrievable stent system for the treatment of de novo or restenotic lesions ...