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tom's Hardware on MSNMysterious AMD Ryzen AI MAX+ Pro 395 Strix Halo APU emerges on Geekbench — processor expected to officially debut at CES 2025With less than one month left to CES 2025, leaked benchmarks have started to surface starring AMD's flagship Strix Halo APUs.
The upcoming Ryzen AI MAX 395+ from AMD's Ryzen 300 or Zen 5 family of APUs has emerged at Geekbench with performance that's largely identical to the desktop Ryzen 9 7950X processor — at least ...
This reported interest in releasing Strix Halo into the desktop market comes via an interview with AMD CEO Dr Lisa Su, conducted by Asus China general manager Tony. When Tony states his hope that ...
During a recent sitdown, Asus General Manager Tony Yu asked Lisa Su if AMD plans to bring its Strix Halo APUs to the desktop. The AMD ...
AMD's just launched its Strix Halo high-end mobile APUs, but progress marches ever forward, and so it goes that we are now looking at leaks concerning the Strix successor, supposedly known as ...
AMD’s Ryzen AI Max “Strix Halo” processors are high-performance mobile chips with integrated graphics that can rival recent mid-range discrete GPUs, support for up to 16 Zen 5 CPU cores ...
TL;DR: AMD's upcoming Zen 6-based Medusa Halo APU will feature 24 cores and 48 threads, with up to 48 GPU cores, offering performance comparable to NVIDIA's RTX 5070 Ti. AMD's next-generation Zen ...
Strix Halo, AMD's upcoming and extremely large APU, has finally seen some benchmarks in 3DMark Time Spy. These early results are in line with its Geekbench debut last December. This is not only a ...
A leaked benchmark of the Radeon 8060S, powering the graphics engine of AMD's Ryzen AI 300 "Strix Halo" flagship is shown to match Nvidia's dedicated RTX 4060 mobile GPU in a leaked 3DMark Time ...
AMD’s Ryzen AI Max “Strix Halo” processors are high-performance mobile chips with integrated graphics that can rival recent mid-range discrete GPUs, support for up to 16 Zen 5 CPU cores ...
Similar to Strix Halo, the CPU cores should have their own chiplet that docks onto a large die with all other SoC components. With this approach, AMD could use the same CPU chiplet in both ...
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