Indium compounds are showing great promise for 3D in-memory compute and RF integration, but more work is needed. Researchers continue to make headway into 3D device integration particularly with ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

One of the scientists on the team recently shared a post to Reddit answering questions about the development. The setup uses lasers to 3D print extremely small structures that can be fine-tuned in ...

Researchers recently shared details on creating foldable, self-locking structures by using multi-material 3D printing. These origami-inspired designs can transition between flat and three-dimension… ...

Architector generates 3D structure predictions of high coordinate organometallics, such as this neodymium core (green) bound to an organic ligand at 10 sites (carbon = grey, oxygen = red, nitrogen ...

Improvements in three-dimensional (3D) scanning have enabled quick and accurate scanning of 3D objects, including cultural heritage objects, as 3D point cloud data. However, conventional edge ...