M5 Pro chip could separate CPU and GPU

Apple M5 chips to enter production in 1H 2025 with enhanced thermals and efficiency
Apple insider and analyst Ming-Chi Kuo has revealed a slew of new information about Cupertino's upcoming M5-series processors. The new chips are expected to power a
Apple's M5 Pro chips could be "server-grade" because of one huge upgrade
According to reliable Apple analyst Ming-Chi Kuo, in a Medium post on Monday, Apple will utilize "server-grade SoIC [System-on-Integrated-Chip] packaging" in its M5 Pro, M5 Max, and M5 Ultra chips, excluding only the base M5 chip.
Apple M5 Pro chipset to feature separate CPU and GPU for server-grade performance
Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage of TSMC's latest chip-packaging technology, known as SoIC-mH.
Apple expected to begin M5 chip development in H1 2025 with separate CPU-GPU architecture: Report
Ming-Chi Kuo, a supply chain expert at TF International Securities, predicts that mass production of the M5 chip will begin in the first half of 2025. The M5 Pro and Ultra models will follow, entering production in the second half of 2025 and 2026,
M5 Pro may separate out GPU and CPU for new server-grade performance
Analyst Ming-Chi Kuo says that Apple will move away from its current processor designs that keep the CPU and GPU cores on the same chip — and see a performance gain.
Kuo: Apple M5 Pro, Max and Ultra chips will offer server-grade performance
The M5 chip is expected to enter mass production in H1 2025. With the Apple M4 series chips already out on the latest Macs, noted Apple analyst
The M5 chip will be a huge change — and it’s coming in 2025
A new report from Ming-Chi Kuo reveals some of the details on Apple's next-gen M5 chip, including some of the major changes coming.The Latest Tech News, Delivered to Your Inbox
Macs With M5 Chips Expected to Launch in This Order
Apple supply chain analyst Ming-Chi Kuo today outlined mass production timing for the M5 series of chips, which he expects to be used in both
Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies
Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a ...
iPhone 18 Pro details and M5 Mac release date both might’ve leaked
In a blog post on Medium, Apple insider Ming-Chi Kuo revealed interesting details about Apple's future iPhone 18 and M5 Mac ...
Apple’s M5 chips may have a new design: How can it improve next-gen iPhones and Macs
Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming ...
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Apple's high-end M5 chip variants might not use an SoC design
Apple's high-end M5 chip variants might feature a new design that separates the CPU and GPU into server-grade chips.