TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...
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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacksTSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...
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TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodesTSMC is also optimizing its packaging technologies, particularly CoWoS-L and CoWoS-R ... enable HBM4 memory subsystems a few years down the road.
This new generation of TSMC's CoWoS â„¢ test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's ...
The technology integrates microring modulators with advanced packaging like CoWoS or SoIC. Mass production is expected in late 2025, with shipments in 2026. TSMC's next-gen silicon photonics ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
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