The board is first mounted on a stable surface, and has solder paste applied, before components are placed with tweezers. Perfect placement isn’t necessary, as the surface tension of the molten ...

[Jan Mrázek]’s success with 3D printing a solder paste stencil is awfully interesting, though he makes it clear that it is only a proof of concept. There are a lot of parts to this hack ...

Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...

Reflow Oven Market is expanding due to demand for miniaturized electronics, automation, and energy-efficient solutions. Explore trends & forecasts by 2035.