Malaysian based wafer foundry, SilTerra Malaysia Sdn. Bhd., today unveiled a "Piezoelectric Micromachined Ultrasound transducer (PMUT) on CMOS" platform for finger-print sensing and medical ...

After entering the CMOS Image Sensor (CIS) market in 2016, hybrid bonding technology has started to be investigated by other industries, such as memory.

In addition, the CEA-Leti team demonstrated for the first time ring oscillators and SRAM bitcells processed at 500°C, further paving the way for high-performance 3D monolithic CMOS integration, ...

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...