After entering the CMOS Image Sensor (CIS) market in 2016, hybrid bonding technology has started to be investigated by other industries, such as memory.

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

“Combining hybrid bonding with HD TSVs in CMOS image sensors could facilitate the integration of various components, such as image sensor arrays, signal processing circuits and memory elements, with ...

In addition, the CEA-Leti team demonstrated for the first time ring oscillators and SRAM bitcells processed at 500°C, further paving the way for high-performance 3D monolithic CMOS integration, ...