US semiconductor giant Intel said it would expand its chip packaging and testing base in Chengdu, in a show of commitment to the mainland market despite a recent call by a Beijing-backed ...

Intel said the $2.5 billion (U.S.) wafer fabrication plant will not be equipped with its latest technology. It will be Intel’s first “chip fab” in Asia and its eighth worldwide.

Early in 2003, the semiconductor maker Intel Corp announced it would go to Chengdu to set up a factory where semiconductor chip packages would be tested. The plant started operating in 2005.