Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

Figure 2 The indium-gallium phase diagram shows the eutectic point is below room temperature, only 15°C (Source: Harvard University). The non-technical media are ranting that this will replace ...

In their work, the researchers were investigating the properties of indium oxide, a material that, when chilled to a certain temperature, changes to a superconductor—it is also known to have ...