“Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the ...

micro-bump pitch matched to the DRAM pitch, east-west orientation (PHY can be placed in corner of die) and a register interface for state observation. Interested in learning more about Rambus’ HBM ...