HBF may operate at a slower speed even though it has an HBM interface. In the HBM4E generation, Micron is allowing "certain customers" (i.e. NVIDIA) to customize the logic die in the memory stack.

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering ...

The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne’s Magnum 7H is a next-generation memory tester engineered ...

The growing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne's Magnum 7H is a next-generation memory tester engineered to ...

SK hynix is reportedly drastically raising its next-gen HBM4 supply price, with NVIDIA diversifying its HBM4 supply chain ...

The tester helps check memory chips faster and better. It could be important for making AI and cloud devices work well at large scale.

NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High ...

Samsung Electronics, which handed over leadership in the HBM3E (fifth-generation HBM) market to SK hynix and Micron, is putting all its efforts into the production of HBM4 logic dies.

Micron's HBM4 will use the company's DRAMs made on its proven 1β (5th Generation 10nm-class process technology), placed on top of a base die featuring a 2048-bit wide interface and a data ...

chosun.com, Apr. 16, 2025 – Samsung Electronics’ foundry unit has stabilized test yields for the logic die powering next-generation high-bandwidth memory (HBM4) chips. The milestone marks an important ...

The tech in question involves a new 3D packaging method that belongs to Samsung’s Advanced Interconnect Technology (SAINT) platform, with this latest iteration being dubbed SAINT-D. Each variant ...