Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

However, DRAM probe-card revenue reached a third consecutive quarterly record, driven by high demand for DDR5 and HBM ...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high ...

The ongoing transition from DDR4 to DDR5 and high-bandwidth memory (HBM) continues to shape the server DRAM market. Major suppliers are reallocating production capacity from DDR4 to newer ...

Micron’s revenue will be $3.8B from HBM this fiscal year. Which will offset the decline in NAND and traditional DRAM revenue. Micron’s fiscal year 2026 will be the peak in terms of annual ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height, a DFI-style interface to the memory controller, 2.5D interposer connections between the PHY and DRAM, a validated ...

Supply-side projections indicate a surge in DRAM availability by 2025, with a significant portion of new industry capacity geared towards advancing HBM and DDR5 technologies. The current downturn ...

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

Rumor mill: The DRAM industry could be in for a major shake ... shifting focus toward DDR5 and high-bandwidth memory (HBM) products for the foreseeable future. Halting production of older memory ...

TL;DR: Samsung Electronics plans to launch its next-generation low-power wide I/O (LPW) DRAM, also known as low-latency wide I/O (LLW), in 2028. This "mobile HBM" memory aims to enhance on-device ...