SK hynix Inc. said Wednesday it has shipped samples of the next-generation high bandwidth memory (HBM), 12-layer HBM4, to its ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

SK hynix Inc. said Wednesday it has unveiled a sample of its next-generation high bandwidth memory (HBM) for the first time ...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high ...

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height, a DFI-style interface to the memory controller, 2.5D interposer connections between the PHY and DRAM, a validated ...

Micron Technology has delivered its sixth-generation 10nm DRAM samples ahead of schedule, pressuring Samsung Electronics as it struggles with yield issues and design adjustments. South Korean media, ...

Micron’s revenue will be $3.8B from HBM this fiscal year. Which will offset the decline in NAND and traditional DRAM revenue. Micron’s fiscal year 2026 will be the peak in terms of annual ...

Rumor mill: The DRAM industry could be in for a major shake ... shifting focus toward DDR5 and high-bandwidth memory (HBM) products for the foreseeable future. Halting production of older memory ...

TL;DR: Samsung Electronics plans to launch its next-generation low-power wide I/O (LPW) DRAM, also known as low-latency wide I/O (LLW), in 2028. This "mobile HBM" memory aims to enhance on-device ...

Samsung Electronics noted during the earnings conference call for the fourth quarter of 2024, held on the 31st, that "the DRAM business will ... 1.9 times increase in HBM sales, misses ...