In this case, each processor could cost around $290 without dicing, testing, packaging, and binning, assuming that TSMC charges Nvidia $16,000 per N4/N5 wafer. If only absolutely perfect die were ...

The die size of AMD's Navi 48 GPU, produced on TSMC's 4nm-class process technology, is around 390 mm², according to the calculations of blogger David Huang. The GPU is slightly larger than Nvidia ...

Creating a detailed die shot of any processor isn't simple. It takes many failed attempts, involving numerous cracked chips and skin burns, to perfect the process. If that chip just so happens to ...

The AMD Radeon RX 9000 Series and its RDNA4 architecture has proven that the red chipmaker is still able to give NVIDIA and ...

Sony's next-generation PlayStation 6 console APU rumor update: Robin APU teased, with Robin+ APU on die shrink from TSMC ...

The leak is a follow up from previous leaks reported by Moore's indicating that the console, allegedly codenamed Magnus, will ...

The CPU cores seem to share 16MB of L3 cache—one-half that of a typical Zen 4 processor—while the integrated GPU is just two WGPs, equating to four compute units or 256 shader cores.

HBM is considerably faster than DDR4 or DDR5 memory and sits on the processor die right next to the CPU/GPU core with a high speed interconnect, rather than on memory sticks like DDR memory.

Featuring the AD104-250 GPU processor manufactured using TSMC’s advanced 5nm process, this card boasts a remarkable 295mm² die housing 35.8 billion transistors.