TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball ...

TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball ...

The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related ...

Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible ...

MELVILLE, N.Y., Feb. 23, 2024 /PRNewswire/ -- Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability ...