Through-hole assembly means bending leads on components and putting the leads through holes in the circuit board, then soldering them in place, and trimming the wires. That took up too much space a… ...

By Alison Job for BRADY CorpJohannesburg, 07 Apr 2020 Visit our company zone ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in develop… ...