According to reliable Apple analyst Ming-Chi Kuo, in a Medium post on Monday, Apple will utilize "server-grade SoIC [System-on-Integrated-Chip] packaging" in its M5 Pro, M5 Max, and M5 Ultra chips, excluding only the base M5 chip.

A new report from Ming-Chi Kuo reveals some of the details on Apple's next-gen M5 chip, including some of the major changes coming.The Latest Tech News, Delivered to Your Inbox

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Analyst Ming-Chi Kuo says that Apple will move away from its current processor designs that keep the CPU and GPU cores on the same chip — and see a performance gain.

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates

The M5 chip is expected to enter mass production in H1 2025. With the Apple M4 series chips already out on the latest Macs, noted Apple analyst

Kuo confirmed that the iPhone 18, expected to launch in 2026, will feature a variable aperture lens on its wide-camera module. This advanced system, allowing users to adjust aperture size mechanically, is set to significantly improve photography capabilities.

Apple's high-end M5 chip variants might feature a new design that separates the CPU and GPU into server-grade chips.